SRC White Paper (“Hardware Security (HWS) Solicitation”) June 2024

Lifecycle Security Assurance for 2.5D/3D Heterogeneously Integrated Systems

References

  1. J. Talukdar, A. Chaudhuri, J. Kim, S. K. Lim, and K. Chakrabarty, “Securing Heterogeneous 2.5D ICs Against IP Theft through Dynamic Interposer Obfuscation,” in IEEE Design, Automation & Test in Europe Conference & Exhibition (DATE), pp. 1–2, 2023.
  2. M. S. M. Khan, C. Xi, M. S. U. Haque, M. M. Tehranipoor, and N. Asadizanjani, “Exploring advanced packaging technologies for reverse engineering a System-in-Package (SIP),” in IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023.
  3. J. Talukdar, A. Vyas, and Chakrabarty, “Detection of Voltage Droop-induced Timing Fault Attacks due to Hardware Trojans,” under review for IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2024.
  4. J. Talukdar, S. Chen, A. Das, S. Aftabjahani, P. Song, and K. Chakrabarty, “A BIST-based Dynamic Obfuscation Scheme for resilience against Removal and Oracle-guided Attacks,” in IEEE International Test Conference (ITC), pp. 170–179, 2021.
  5. J. Talukdar, A. Chaudhuri, and K. Chakrabarty, “TaintLock: Preventing IP theft through lightweight Dynamic Scan Encryption using Taint Bits,” in IEEE European Test Symposium (ETS), pp. 1–6, 2022.
  6. E. Ortega, J. Talukdar, W. Paik, F. Su, R. Chattopadhyay, and K. Chakrabarty, “E-scout: Efficient Spatial Clustering-based Outlier detection through Telemetry,” under review for IEEE International Test Conference (ITC), 2024.