Research
ACME Research
ACME researchers collaborate with faculty in other Centers on packaging, wireless communication, signal processing, biomedical systems, etc. There are strong ties to Core facilities in chip fabrication and characterization.
Research Areas
Analog, Mixed-Signal, and RF Circuit Design
Artificial Intelligence Accelerators
Chips/Packaging Co-design
Design Automation Tools
Design for Test
Design for Manufacturability
Emerging Semiconductor Devices
Logic and Memory Technologies
Power Management
Radiation testing, Radiation hardening, circuits for extreme environments
Security, Trust, and Assurance
System Architectures
5G/6G/Next-G Communications