ACME Research
ACME researchers collaborate with faculty in other Centers on packaging, wireless communication, signal processing, biomedical systems, etc. There are strong ties to Core facilities in chip fabrication and characterization.
Research Areas
- Analog, Mixed-Signal, and RF Circuit Design
- Artificial Intelligence Accelerators
- Chips/Packaging Co-design
- Design Automation Tools
- Design for Test
- Design for Manufacturability
- Emerging Semiconductor Devices
- Domain Specific Languages
- Logic and Memory Technologies
- Power Management
- Radiation testing, Radiation hardening, circuits for extreme environments
- Security, Trust, and Assurance
- System Architectures
- 5G/6G/Next-G Communications
- AI Compilers
- Machine Learning Acceleration