ACME News and Events
Recent news
Diagnosing Data Corruption
Computer servers store the data for all the videos, games and information accessed online. Krishnendu Chakrabarty, the Fulton Professor of Microelectronics, has been given the Driving Innovation in SDC Mitigation Award from the Open Compute Project Foundation to develop quality assurance testing that will improve the reliability and function of data servers.
Innovators at ACME advance microelectronics for extreme environments
This article from The Arizona State Press offers an overview of the ASU Center for Advanced Microelectronics (ACME), which provides a platform for industry, government agencies, students and faculty to collaborate on devices used in harsh environments.
Third CHIPS for America R&D Flagship Facility Announced
Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility. Many of ASU’s ACME faculty will be involved in the research at this facility.
ASU and Deca Technologies selected to lead $100M SHIELD USA project to strengthen U.S. semiconductor packaging capabilities
The National Institute of Standards and Technology — part of the U.S. Department of Commerce — announced today that it plans to award as much as $100 million to Arizona State University and Deca Technologies for the SHIELD USA initiative.
The project will drive innovation in the domestic microchip packaging ecosystem, expand capacity for domestic advanced packaging and help regain U.S. leadership in microelectronics while strengthening national security.
A number of ACME Center faculty are involved in this project including: Christopher Bailey, Sule Ozev, Hongbin Yu and Krish Chakrabarty.
How computer science can supercharge the semiconductor industry
ASU gets $2M NSF grant to create an ultra-energy-efficient chip, fill microelectronics workforce shortages. This project is lead by ACME Center Faculty, Sarma Vrudhula. https://news.asu.edu/20241022-science-and-technology-how-computer-science-can-supercharge-semiconductor-industry
5 microelectronics projects win nearly $30M in federal funding at ASU
Congratulations to the many ACME Faculty that are leading or collaborating on the following projects!
Integrated RF GaN Technology to Support NextG, 5G & 6G Wireless Systems
ACME Center Faculty: Jennifer Kitchen, Sule Ozev, Hongbin Yu, Chris Bailey, Arindam Sanyal
Spaceborne Low-Energy AI Computing
ACME Center Faculty: Matthew Marinella, Hugh Barnaby, Krishnendu Chakrabarty, Arindam Sanyal
Multi-MHz, High Density, Ultra-fast RADAR Power Converter
ACME Center Faculty: Bertan Bakkaloglu
You can read more about the projects here: 5 microelectronics projects win nearly $30M in federal funding | ASU News
ACME Center Director, Krish Chakrabarty is the CTO of the Southwest Advanced Prototyping (SWAP) Hub and several ACME Faculty are capability and theme leads.
Matthew Marinella
Capability Co-Lead
Christopher Bailey
Heterogeneous Integration Capability Lead
Sule Ozev
Circuits, Architectures, and Test Capability Lead
Hugh Barnaby
Rad-Hard/Extreme Environment Reliability Theme Lead
ACME Director at SWAP Hub Members Meeting, June 2024
Growing the semiconductor ecosystem
In June 2024, 95 individuals from 45 member companies and universities joined SWAP Hub at Arizona State University’s Mountain View Stadium for a day of presentations, panel discussions, and networking around microelectronics prototyping and lab-to-fab technology innovations. Kyle Squires, SWAP Hub Founding CEO and Senior Vice Provost of Engineering, Computing, and Technology at ASU’s Fulton Schools of Engineering, opened the day stating Phoenix is ground zero for semiconductors, and outlined SWAP Hub’s critical role in connecting the growing ecosystem in Arizona to a national network of partners.
Jason Conrad, SWAP Hub COO, outlined our membership base and how the hub carries out its mission operationally, while Krishnendu Chakrabarty, CTO, introduced faculty members leading capability areas. Squires, Conrad, and Chakrabarty’s message that solving the United States’ complex microelectronics situation will take a collective group of ideas, individuals and organizations was heard – and the networking began. Speakers from both large and small corporations and businesses made technology push and pull elevator pitches.
Speakers included Boeing, Infineon, MAC Southwest, Northrop Grumman, NXP, and RTX as well as Atomera, Idaho Scientific, Lawrence Semiconductor, Mojo. A workforce development panel discussed new initiatives for developing and digitizing training infrastructure, along with raising awareness among K-12 students and under-served communities.
During the poster session, organizations had the opportunity to showcase their unique role in the semiconductor industry while meeting and identifying companies to collaborate with on future projects. Lunch and the evening’s reception also allowed hub members to get to know one another and brainstorm how SWAP Hub’s unique capabilities can address issues facing the industry.
An ASU-led Microelectronics Commons Hub helps build the workforce and technology needed to secure the US semiconductor future
Strengthening semiconductor skills at the SWAP Hub Mar 2024: https://fullcircle.asu.edu/fulton-schools/strengthening-semiconductor-skills-at-the-swap-hub/
Waymo’s plans for self-driving cars to take to the freeways.
Aviral Shrivastava Jan 2024: https://fullcircle.asu.edu/external/waymos-driverless-cars-aim-to-revolutionize-freeway-travel/.
DOD visit to the SWAP Hub on Jan 2024
Krish Chakrabarty: https://news.asu.edu/20240205-science-and-technology-dod-officials-convene-asu-learn-about-universityled
Jeff Zhang’s Top Picks in Test and Reliability IEEE award Dec 2023
Hongbin Yu Dec 2023: doctoral student’s efforts to make a streamlined open-source semiconductor design software suite:
https://fullcircle.asu.edu/students/democratizing-semiconductor-design/
Making eco-friendly microelectronics
ASU researcher Vidya Chhabria leads research to measure VLSI electronics’ carbon footprint.https://fullcircle.asu.edu/research/making-eco-friendly-microelectronics/
ASU awarded $10M to advance future-generation wireless networks
Chaitali Chakrabarti Oct 2023: co-PI of the FutureG Center of Excellence’s research efforts. https://fullcircle.asu.edu/fulton-schools/asu-awarded-10m-to-advance-future-generation-wireless-networks/
Putting medical tests to the test
ASU researcher Krishnendu Chakrabarty helps to ensure safety and accuracy of lab-on-a-chip devices using watermarks Sep 2023: https://fullcircle.asu.edu/research/putting-medical-tests-to-the-test/
Taking semiconductor manufacturing to new heights
ASU researcher Ying-Chen “Daphne” Chen is working with collaborators on a NASA project to manufacture microelectronics in space Sep 2023: Working with NASA on methods to manufacture microelectronics in space: https://fullcircle.asu.edu/research/taking-semiconductor-manufacturing-to-new-heights/.
Opening the black box
ASU researchers innovate decision-making in design space exploration Aug 2023: Traditionally, black box explorations don’t reveal AI’s reasoning for its decisions. By adding explainability, humans can then understand how to improve the AI: https://fullcircle.asu.edu/research/opening-the-black-box/
Putting microelectronics to the test
ASU Professor Sule Ozev collaborates with NXP Semiconductors and Advantest to offer a course in microelectronics testing June 2023: https://fullcircle.asu.edu/fulton-schools/putting-microelectronics-to-the-test/
Call for Papers
| IEEE Journal on Exploratory Solid-State Computational Devices and Circuits Call for Papers: Special Topic on 3D Logic and Memory for Energy-Efficient Computing Important Dates Open for Submission: 15 February 2024 Submission Deadline: 31 May 2024 First Notification: 30 June 2024 Revision Submission: 15 July 2024 Final Decision: 31 July 2024 Publication Online: 15 August 2024 |
Symposium
The ACME Center is sponsoring and participating in the IEEE VLSI Test Symposium (VTS) on April 28-30, 2025.
The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in test, validation, yield, reliability, and security of microelectronic circuits and systems.
Seminar Speakers
Dr. Subramanian S. Iyer, Distinguished Professor Charles P. Reames Endowed Chair, Electrical Engineering Department, UCLA – June 25, 2025 3:00 pm – 4:00 pm at ASU MacroTechnology Works, 7700 S. River Parkway, Tempe AZ Seminar Title, “Strategic Directions for Electronics Packaging.”
Dr. David Z. Pan, Professor, Silicon Labs Endowed Chair Department of Electrical and Computer Engineering, The University of Texas at Austin- May 2, 2025 10:30 AM– 11:30 AM in GWC 487 Seminar title, “AI for Chip Design: Everything, Everywhere, All at Once?”
Dr. Prabhat Mishra, Professor, Department of Computer and Information Science and Engineering, University of Florida– March 27, 2025 1:30 PM– 2:30 PM in GWC 487. Seminar title, “Securing Hardware for Designing Trustworthy Systems.”
Dr. Madhavan Swaminathan, Penn State University – March 7, 2025, 10:00 – 11:00 AM in GWC 487. Seminar title, Moore’s Law, Advanced Packaging and Heterogeneous Integration Do they hold the key for enabling Future AI Systems?”
Dr. Deming Chen, Abel Bliss Professor in the Grainger College of Engineering, University of Illinois Urbana-Champaign- February 21, 2025 10:00 AM– 11:00 AM in GWC 487. Seminar title, “The Next Wave of HLS: Fully Automated PyTorch-to-Accelerator Design Flow.”
Distinguished Seminar with Dr. Jason Cong, UCLA Computer Science Department, Director, Center for Domain-Specific Computing (CDSC)- February 11, 2025 2:00 PM– 3:00 PM in GWC 487. Seminar title, “Automate Chip Design with Deep Learning and HLS.”
Dr. Adit D. Singh. Godbold Endowed Chair Professor of Electrical and Computer Engineering, Auburn University – January 31, 2025 1:30 PM– 2:30 PM in GWC 487. Seminar title, ” Silent Data Corruption: Mitigating Timing Marginalities from Process Variations.”
Distinguished Seminar with Ms. Ritu Favre, President, Test & Measurement Business Group, Emerson – January 17, 2025, 1:30 PM – 2:30 PM in GWC 487. Seminar title, ” Solving Business Challenges Through Test & Measurement.”
Dr. Tsung-Wei Huang, Assistant Professor, University of Wisconsin-Madison – October 24, 2024, 2:00 PM – 3:00 PM in GWC 487. Seminar title, “Intelligent High-performance Computing: Classical and Quantum.”
Dr. Kanad Basu, Assistant Professor, University of Texas at Dallas – October 17, 2024, 1:30 PM – 2:30 PM in GWC 487. Seminar title, Anti-virus hardware: Exploring the new domain in system security.”
Dr. Jun Zeng, Distinguished Technologist, HP Inc. – September 13, 2024, 1:30 PM – 2:30 PM in ERC 490. Seminar title, “Digital Twin – how AI accelerates the integration of bits and atoms to tackle manufacturing challenges.”
Dr. JV Rajendran Associate Professor, Texas A&M University – April 25, 2024 1:30 PM – 2:30 PM in Goldwater Center room 487. Seminar title, “Hardware Fuzzing: What? Why? How?”
Dr. Mehdi B. Tahoori, Professor and the Chair at Karlsruhe Institute of Technology (KIT) – April 25, 2024 9:30 AM – 10:30 AM in Goldwater Center room 487. Seminar title, “Chip Ecosystem in Europe, Germany, and Baden-Württemberg: Opportunities for Cooperation.”
Dr. Asad M. Madni Distinguished Seminar and Reception – “KEY ELEMENTS OF A BUSINESS PLAN FOR A START-UP COMPANY”
April 3, 2024, Seminar 3:00 PM – 4:00 PM- Reception 4:00 PM – 5:00 PM
Marston Exploration Theater. ISTB 4
RSVP on eventbrite
Onur Mutlu, ETH Zurich Distinguished Seminar – March 28, 2024, 3:30 PM – 4:30 PM in Goldwater Center room 487. Seminar title, ” Memory-Centric Computing.”
Sanmitra Banerjee, NVIDIA Corporation presents March 20, 2024, 3:30 PM- 4:30 PM in Goldwater Center room 487. Seminar title, “Reliability of Carbon-Nanotube FET Circuits – Today’s Challenges and the Road Ahead in the Age of AI”
Andrew Dove, NI presents February 21, 2024, 3:00 PM – 4:00 PM in Goldwater Center room 487. Seminar title, “Uses of AI in the test and measurement industry.”
Presentation by Yibo Lin on October 27, 2023
Accelerating Timing Closure of Integrated Circuits with Heterogeneous Computing and Machine Intelligence